Storage Servers

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)

Rackmount 1U4 +2 Bay with Intel Core i3 3.9 GHz Dual-Core CPU, 8GB DDR4 RAM (Max 64GB).

. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slots 4. Single port IB (FDR, 56Gbps), w/ QSFP connector

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 4x 40mm and 4x 80mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

Dual-Controller SAN System, iSCSI, RAID 0,1, 5, 6, 10, 50, 60, global hot spare, max 256GB RAM, 4-ported 10GbE BASE-T iSCSI, redundant power supply, 4 slots for optional host cards ( Slot 1: Optional host cards for 32/16Gb X 2/4 ports Fibre Channel, or 25/10Gb X 2/4 ports iSCSI, or 1Gb X 4 ports iSCSI card; Slot2: 10Gb X 4 ports iSCSI, or 1Gb X 4 ports iSCSI card), rail kit (optional).

Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP. Supports 32 DIMMs with 2DPC, up to 8TB memory capacity with 32 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory Two PCIe 5.0 x16 slots & two PCIe x8 slots and two AIOM connectors (OCP 3.0 SFF compliant) 24x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 2000W Power Supplies

2S Intel Sapphire Rapids CPU 16 DIMM slots with DDR5-4800 memory support 12 3.5" SATA with opt. 4 NVMe U.2 hot-swap, tool-less drive bays 2 2.5" SATA hot-swap, tool-less drive bays @ rear PCIe 5.0 x16 OCP v3.0 LAN mezzanine slot 2 NVMe M.2 2280 slots 2 10GBase-T LAN + 1 dedicate 1000Base-T IPMI ports (1+1) CRPS

2S AMD EPYC Milan / Rome CPU 16 DIMM slots w/ DDR4 3200 memory support 4 NVMe U.2 + 12 3.5" SATA hot swap, tool less drive bays @front 2 2.5" SATA hot swap, tool less drive bays @ rear Up to 7 PCIe 4.0 slots (2) 10GBase-T LAN + (2) 1000Base-T + (1) 1000Base-T dedicated IPMI ports (1+1) RPSU

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 1 PCI-E 3.0 x4 (in x8), 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 2.0 x2 (in x4), 1 PCI-E 2.0 x4 (in x8)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

Unified storage with dual-controller design. Rackmount 2U26 Bay with Intel Xeon 2.2GHz Quad-Core CPU, 32GB DDR4 RAM (Max 256GB). 4 slots for optional host cards (Slot 1 & Slot 2: Optional host cards for 2/4 x 32/16Gb Fibre Channel, or 2/4 x 25/10Gb iSCSI)