4 GPU

***The price is only indicative - it has not yet been determined by the manufacturer*** 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 20 PCI-E 3.0 x16 support up to 20 single width GPU; 1 PCI-E 3.0 x8 (FH, FL in x16 slot) 4. 24 Hot-swap 3.5" drive bays (2 Optional U.2 NVMe 2.5" drives) 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (4 NVIDIA GPU/Xeon Phi cards opt.), 2 PCI-E 3.0 x8 (in x16) LP slot 4. Intel i350 Dual port GbE LAN 5. 2 Hot-swap 2.5" drive bays, 2 internal 2.5" drive bays 6. 9x 4cm heavy duty counter-rotating fans with air shroud & optimal fan speed control 7. 2000W Redundant Power Supplies Platinum Level (94%+)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 11 PCI-E 3.0 x16 (FH, FL) slots 1 PCI-E 3.0 x8 (FH, FL in x16 slot) 4. Up to 24 Hot-swap 2.5" drive bays; 10x 2.5" drives supported natively, 1 NVMe based M.2 SSD 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

High density 2U GPU system with up to 4 NVIDIA® H100 PCIe GPUs Highest GPU communication using NVIDIA® NVLINK™ PCIe-based NVIDIA L40s PCIe-based NVIDIA H100 NVL with NVLink Bridge Support Energy-Efficient NVIDIA Grace™ CPU Superchip with 144 Cores

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM 4U system with NVIDIA® HGX™ A100 4-GPU 6 PCI-E Gen 4.0 X16 LP Slots Highest GPU communication using NVIDIA® NVLINK™ Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 4 PCI-E 3.0 x16 (FHFL), 1 PCI-E 3.0 x16 (LP) and 1 PCI-E 3.0 x8 (LP) 4. 2 Hot-swap 2.5" NVMe drive bays, 2 Internal 2.5" SATA drive bays 5. Support 1x M.2 2242/2260/2280, Support M.2 SATA and NVMe 6. 2x 10GBase-T LAN ports via Intel X540 7. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control 8. 2000W Redundant Power Supplies Titanium Level (96%)

1. Acoustically optimized for quiet operation 2. 5th/4th Gen Intel® Xeon® Scalable processor support 3. Intel® C741 Chipset 4. 6 PCIe 5.0 x16 5. 8x 2.5" peripheral drive bays 6. Up to 8x NVMe SSD support

1. High density 2U GPU system with up to 4 NVIDIA® PCIe GPUs 2. NVIDIA® NVLINK™ using PCIe-based H100 NVL 3. 5th/4th Gen Intel® Xeon® Scalable processor support 4. Up to 8TB: 32x 256 GB DDR5 RAM Memory 5. 7 PCIe 5.0 x16 FHFL Slots