Supermicro

High density 8U system with NVIDIA® HGX™ H100 8-GPU Highest GPU communication using NVIDIA® NVLINK™ + NVIDIA® NVSwitch™ 8 NIC for GPU direct RDMA (1:1 GPU Ratio) 24 DIMM Slots; Up to 6TB DRAM; 4800 ECC DDR5 LRDIMM;RDIMM; 8 PCIe Gen 5.0 X16 LP, and up to 4 PCIe Gen 5.0 X16 FHFL Slots Flexible networking options

1. Acoustically optimized for quiet operation Closed-loop liquid cooling for CPUs and GPUs 2. 4 liquid-cooled NVIDIA A100 GPUs with NVIDIA® NVLink™ (2+2) installed 3. Dual 4th Gen Intel® Xeon® Scalable Processors, 6444Y (16 cores at 3.6Ghz) installed 4. Dual-port active-cooled NVIDIA Connect-X6 Dx 25G Network Adapter installed 5. Supermicro Cloud Orchestrator AI software stack

1. 20 High performance DP blade servers in a 8U High blade enclosure 2. Liquid cooling support 3. PCIe Gen. 4 ready for SSD and Network IO 4. InfiniBand 200G HDR support 5. Front Access Design - front-loading nodes, HDD/SSD hot-swap and management 6. Security enhancement from booting to management

1.20 High performance UP blade servers in a 8U High blade enclosure 2.Blade AIOM Card support 3.PCI-E Gen4 ready for SSD and Network IO 4.InfiniBand 200G HDR support 5.Front Access Design - front-loading nodes, HDD/SSD hot-swap, management and network IO 6.Security enhancement from booting to management

X10 4U72 Ceph data node w/360TB volume and SSD.

X10 4U72 Ceph data node w/432TB volume . No SSD.

Number of ports: 64 Port type: OSFP Port speed: 800 Gb

1. Intel® Xeon® Processor D-2191I, 18-Cores, 36 Threads 2. 2x 3.5" SATA3 by default; 2x 2.5" hybrid SATA3/NVMe w/ Optional kits 3. Up to 512GB ECC LRDIMM, Up to 256GB ECC RDIMM, up to DDR4-2400MHz; in 4 DIMM slots 4. 2 GbE LAN ports via Intel i350 5. 1 Centralized IPMI management port 6. 1 PCI-E 3.0 x16 (low-profile), 1 Micro-LP, and 2 M.2 7. 2 USB 2.0, 1 VGA, 1 COM port, (with KVM dongle) 8. 4 heavy duty hot-swap 8cm fans with optimal cooling zone (per system) 9. 1600W Redundant power supplies Titanium Level Certified (per system)

Dual Intel® Xeon® 3rd Gen Scalable Processors (Ice Lake) TDP up to 270W Intel® C621A Chipset 32x DIMM slots, up to 8TB Registered ECC DDR4 3200MHz SDRAM 2x PCIe 4.0 x16 FHFL slot and 2x PCIe 4.0 x8 FHFL slot 6x 400GbE QSFP-DD for scale-out and 1x 1GbE BaseT (dedicated IPMI port) 4x 2.5”NVMe Hot-Swap Drive Bays Up to 16x 2.5" SATA Hot-Swap Drive Bays (Additional SAOC is required) Up to 8x 2.5" SATA Hot-Swap Drive Bays 12x Removable Heavy-Duty FANs (Includes 2x Dummy PSU FAN) 6x 3000W(54V+12V) Redundant Power Supplies, Titanium Level

5th/4th Gen Intel® Xeon® Scalable processor support 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5 8 PCIe Gen 5.0 X16 LP 2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional) Flexible networking options

2x Intel Xeon E5-2630 v2 128GB memory per node 6x 2.5in 400GB SSD Hard Drives 30x 3.5in 4TB SATA3 HDDs Internal 2.5in OD drives (mirrored 80GB SSD) 4x 10G SFP+ via 2x AOC-STGN-I2S

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 16 PCI-E 3.0 x16 for RDMA via IB EDR; 2 PCI-E 3.0 x16 on board 4. Supports 16 V100 SXM3 350W GPUs with NVSwitch and NVLink 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" NVMe drives, 6 Hot-swap 2.5" SATA3 drive bays 7. 6x 80mm Hot-swap PWM Fans, 8x 92mm Hot-swap Fans 8. 6x 3000W Redundant Power Supplies; Titanium Level (96%+)