Storage Solutions

1. Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM slots 3. 1 PCI-E 3.0 x16 & 4 PCI-E 3.0 x8 slots 4. Intel® x540 Dual 10GBase-T LAN 5. 24x 2.5" Hot-swap SAS2/SATA3 HDD Bays with direct attached backplane

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

1. 140 CPUs per 42U Rack 2. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 3. Intel® C622 chipset 4. 2 Hot-plug 2.5" NVMe + 1 Hot-plug SAS3/SATA3 drives or 3 SAS3/SATA3 5. Broadcom 3108 HW RAID 6. 24 DDR4 LRDIMM/RDIMM slots 7. Dual 10G onboard 8. IPMI 2.0, KVM over IP, Virtual Media over LAN 9. Graphics: Aspeed AST2500 BMC

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays; 2 rear Hot-swap 2.5" SATA drive bays; optional 6 NVMe bays 6. Broadcom 3008 SAS3 IT mode controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 hot-swap 8cm redundant PWM fans PWM fans 9. 1600W Redundant Power Supplies Platinum Level (94%+) Certified 10. Front 3.5" LCD display

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 7 PCI-E 3.0 x8 slots (5 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 2x 10GBase-T ports 5. 12 Hot-swap 3.5" Drive Bays: Default 8 SATA3 ports, 4 NVMe ports; Optional 12 SAS3 ports via AOC; Optional 2 hot-swap 2.5" rear drive bays for SSDs 6. 4x heavy duty fans w/ optimal fan speed control 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level

1. Supports 32 Hot-swap NVMe SSDs 2. Individual HDD power cycling 3. 4 PCI-E x16 IO ports, 2 PCI-E x16 slots 4. IPMI management with dedicated LAN 5. 1000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8 DIMM slots 3. 3 PCI-E 3.0 x8 low-profile slots per controller 4. Dual 10GBase-T LAN w/ Intel® X540 per node, 100Mb private ethernet between controller nodes 5. Dedicated node to node connectivity featuring high performance PCI-E 3.0 x8 and IPMI for robust node fail-over support 6. 24 shared hot-swap 2.5" SAS drive bay with SES2 7. SAS3 via Broadcom 3008 controller 8. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 9. 8x 4cm PWM counter rotating cooling fans 10. 1200W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8 (slot 1 & 2 occupied by controller and JBOD expansion port) 4. Dual 10GBase-T LAN w/ Intel® X540 5. 16x 3.5" Hot-swap SAS3/SATA3 drive bays; 2x 2.5" optional Hot-swap SATA drive bays (rear) 6. SAS3 Hardware RAID controller and JBOD Expansion; RAID 0,1,5,6,10,50,60 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 2x 80mm hot-swap rear exhaust PWM fans 9. 920W Redundant Power Supplies Platinum Level (94%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 4. 24 Hot-swap 2.5" SAS3/SATA3 direct attached drive bays

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8 (slot 1-3 occupied by controllers)

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options