Storage Solutions

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2x PCI-E 3.0 x16 slots (FH, 10.5" L), 2x PCI-E 3.0 x8 slots (LP, 1 internal) 4. 2x 10G SFP+ ports 5. 10x Hot-swap 2.5" Drive Bays: Default 8x SATA3 ports and 2x NVMe/SATA3 hybrid ports; Optional 8x SAS3 ports via AOC 6. 5x heavy duty fans w/ optimal fan speed control 7. 750W Redundant Power Supplies Platinum Level (94%+)

1. Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM slots 3. 1 PCI-E 3.0 x16 & 4 PCI-E 3.0 x8 slots 4. Intel® x540 Dual 10GBase-T LAN 5. 24x 2.5" Hot-swap SAS2/SATA3 HDD Bays with direct attached backplane

1. 4th Generation AMD EPYC™ 9004 Scalable Processors 2. 12 ECC DDR5-4800: LRDIMM/RDIMM 3. 2 Dedicated PCIe 5.0 x16 AIOM slots (OCP 3.0 SFF compliant) 4. Up to 6x PCIe 5.0 Slots 5. 24 3.5" Hot-swap SAS3/SATA3 drives, 2x Rear SATA Slots, 4x Optional Rear NVMe Slots, 2x NVMe M.2 6. 1600W Redundant Power Supplies Titanium Level (96%)

1. Supports 32 Hot-swap NVMe Ruler SSDs 2. Individual SSD power cycling 3. 4 PCI-E x16 IO ports, 2 PCI-E x16 slots 4. IPMI management with dedicated LAN 5. 1000W Redundant Power Supplies Titanium Level (96%)

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 60x Top-loading hot-swap 3.5" or 2.5" SAS3/SATA3 drive bays, 2x Hot-swap 2.5" SATA drive bays (rear), Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" SATA3/NVMe (rear, optional) 5 Hot-Swap 8cm redundant PWM fans Redundant Titanium 1600W Power Supply

Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots 2x 10 GbE onboard via Broadcom BCM57416 1x GbE Dedicated LAN for server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 16x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear 2.5" SATA Slots, 2x NVMe M.2 (form factor: 2280 and 22110)

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10GBase-T with Intel® X557 5. 36 Hot-swap 3.5" SAS/SATA drive bays with SES3 (24 front + 12 rear); 4 Internal fixed 2.5" drive bays 2 Hot-swap 2.5" NVMe/SATA (rear, optional) 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7 High-performance 8cm PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 1 PCI-E 4.0 x16 (FHHL) slot Intel® Ethernet Controller X550 2x 10GbE RJ45 10x Hot-swap 2.5'' All NVMe tool-less drive bays; Onboard 2x NVMe/SATA M.2 Redundant Platinum 860W Power Supply

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s, Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot 4. Dual port 10GBase-T (Intel® X540), Intel® XL710 used for dedicated heartbeat between 2 nodes in SBB 5. 20 Hot-swap 2.5" dual port NVMe drive bays 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 high-performance 8cm PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%)