Storage Solutions

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 60x 3.5" Hot-swap SAS3/SATA3 drive bays; 2x 2.5" rear Hot-swap SATA drive bays; optional 6 NVMe bays 6. Broadcom 3108 SAS3 HW RAID controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5x 8cm hot-swap redundant PWM fans PWM fans 9. 2000W Redundant Power Supplies Titanium Level (96%) Certified 10. Front 3.5" LCD display

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 3 PCI-E 3.0 x8 slots (2 FH 10.5" L, 1 LP) 4. 2x 10GBase-T ports

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 4. 24 Hot-swap 2.5" SAS3/SATA3 direct attached drive bays

1. 70 CPUs per 42U Rack 2. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 3. Intel® C622 chipset 4. 2 Hot-plug 2.5" NVMe + 1 Hot-plug SAS3/SATA3 drives or 3 SAS3/SATA3 5. Broadcom 3108 HW RAID 6. 12 DDR4 LRDIMM/RDIMM slots 7. Dual 10G onboard 8. IPMI 2.0, KVM over IP, Virtual Media over LAN 9. Graphics: Aspeed AST2500 BMC

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots 2x 10Gbe 12x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hybrid Ports); 2 Rear SATA Slots; onboard 1 M.2 NVMe 3 heavy duty fans with optimal fan speed control; 1 Air Shroud 1600W Redundant Power Supplies Titanium Level (96%) Broadcom® 3816 Controller

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node 16 ECC DDR4-3200: LRDIMM/RDIMM 3 x PCI-E 4.0 x16 HHHL PCI-E slots 60 3.5"/2.5" Hot-swap SAS3/SATA3 drives (Each node controls 30 drives) 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 2600W Redundant Power Supplies Titanium Level (96%) Drive Controller support via Broadcom® 3916 or 3616 Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 4. 24 Hot-swap 2.5" SAS3/SATA3 direct attached drive bays

1. Single AMD EPYC™ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 24 hot-swap 2.5" U.2 NVMe drive bays 7. 1200W Redundant Power Supplies   Titanium Level (96%)

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 16 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 12x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8 4. Dual 10GBase-T LAN w/ Intel® X540

Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP. Supports 32 DIMMs with 2DPC, up to 8TB memory capacity with 32 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory Two PCIe 5.0 x16 slots & two PCIe x8 slots and two AIOM connectors (OCP 3.0 SFF compliant) 24x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 2000W Power Supplies