Supermicro

Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs; AIOM Support

1. Dual Intel® Xeon® Scalable Processors (Ice Lake) TDP up to 270W 2. Intel® C621A Chipset 3. 32x DIMM slots, up to 8TB Registered ECC DDR4 3200MHz SDRAM 4. 1x PCI-E 4.0 x16 FHHL slot plus 2x PCI-E 4.0 AIOM (OCP 3.0 superset) slots 5. 24x on-board 100GbE (via 6x QSFP-DDs) for scale-out and 1x 10GbE BaseT (dedicated IPMI port) 6. 4x 2.5” SAS/SATA/NVMe Hybrid Hot-Swap Bays 7. 5x Removable Heavy-Duty Fan(s) 8. 4x 3000W(54V+12V)/2000W(12V) redundant, Titanium Level power supplies

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM )

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual Intel® Atom processor C2750, SoC, FCBGA 1283, 20W 8-Core 2. 2x 2.5" SATA3 (6Gb/s) HDDs 3. Up to 64GB DDR3 VLP ECC UDIMM 1600MHz support in 4 sockets

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series 10 PCI-E Gen 4.0 X16 LP Slots AIOM/OCP 3.0 Support Flexible networking options 2 M.2 NVMe and SATA 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays 4 heavy duty fans with optimal fan speed control 4x 2200W redundant Titanium level power supplies

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x8 (Micro Low Profile) 4. I/O ports: 2 GbE ports, 1 VGA, 2 USB 3.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 6x 2.5" Hot-swap SAS/SATA via Broadcom 3108 or 4x 2.5" Hot-swap SAS/SATA + 2x optional NVMe 7. 3x heavy duty internal fans 8. 2000W High efficiency (96%) Redundant PSU; Titanium Level

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM )

Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs; AIOM Support

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual Intel® Xeon® processor E5-2687W v4 2. 8x 8GB DDR4-2400MHz (Default), up to DDR4- 2400†MHz ; 16 DIMM slots 3. Expansion slots via riser card: 2 PCI-E 3.0 x16, Full-height, 10.5" Length 1 PCI-E 3.0 x8, Low-profile 1 PCI-E 3.0 x8 SAS3 integrated 4. 4 Gigabit Ethernet LAN ports 5. Integrated IPMI 2.0 with KVM and Dedicated LAN 6. 10 Hot-swap 2.5" Drive Bays: 8 SAS3 (Broadcom 3108), 2 SATA3, 2 NVMe ports support via optional AOC-URN2-I2XT (with 2x 10GBase-T ports) 7. 8 heavy duty fans w/ optimal fan speed control 8. 750W Redundant Power Supplies Platinum Level (94%+)