SuperWorkstations

1. 13th/12th Generation Intel® Core™ i9/i7/i5/i3/Pentium/Celeron Processor (LGA-1700) 2. Intel® Q670E 3. 2x DDR4-3200MHz SO-DIMM max 64GB 4. Support 1x PCIe 5.0 x16 Slot 5. AMT vPro Supported

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1.Single AMD EPYC™ 7002/7003 Series Processor 2.8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3.5 PCI-E 4.0 x16 (FH), 2 PCI-E 4.0 x8 (FH) 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5.4 internal 3.5" SATA3 drive bays and 4 internal 2.5" drive bays M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 2x 1GbE LAN ports 5. 7.1 HD Audio 6. 4 Internal fixed 3.5" drive bays, 2 5.25" peripheral drive bays 7. 1 M.2 slot, 2 NVMe support with optional cables 8. 1200W High-efficiency Power Supply Platinum Level Certified

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Intel® Atom processor C3338, SoC, FCBGA 1310, CPU TDP support 9W 2. 4 Hot-swap 3.5" SATA drive bays, 2 internal 2.5" drive bays, 1 slim DVD-ROM drive bay (shared with 1 internal 2.5") 3. 1 PCI-E 3.0 x2 (in x4) open ended slot

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray) 4. Support 8 Tesla V100 with 300GB/s NVLINK 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2 NVMe based M.2 SSD 7. 8x 92mm cooling fans 8. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. 60 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (for SIOM ) 4. 2 Fixed 3.5" SATA3 drive bays M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 5. Dual GbE ports via SIOM Network card, 1 dedicated IPMI LAN port (front) 6. 1 VGA, 2 USB 3.0 ports (front) 7. 8x 8cm 13.5k RPM rear fans per enclosure 8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)