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Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node 16 ECC DDR4-3200: LRDIMM/RDIMM 3 x PCI-E 4.0 x16 Slots Dedicated PCI-E 4.0 AIOM slot Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node 24 3.5" Hot-swap SAS3/SATA3 drives, 4 x Rear SATA/NVMe Slots, 2x SATA/NVMe M.2 (form factor: 2280) 5x 8cm hot-swap counter-rotate redundant PWM cooling fans 1600W Redundant Power Supplies Titanium Level (96%) HBA Controller support via Broadcom® 3808

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 60x 3.5" Hot-swap SAS3/SATA3 drive bays; 2x 2.5" rear Hot-swap SATA drive bays; optional 6 NVMe bays 6. Broadcom 3108 SAS3 HW RAID controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5x 8cm hot-swap redundant PWM fans PWM fans 9. 2000W Redundant Power Supplies Titanium Level (96%) Certified 10. Front 3.5" LCD display

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 GbE LAN ports via Intel i210 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5" SATA drive bays; optional 2 SATA or NVMe 6. Broadcom 3108 SAS3, HW RAID (AOC-S3108L-H8IR-P ) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 Hot-swap 8cm redundant PWM fans 9. 1600W Redundant Power Supplies Platinum Level

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node 16 ECC DDR4-3200: LRDIMM/RDIMM 3 x PCI-E 4.0 x16 HHHL PCI-E slots 60 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 2600W Redundant Power Supplies Titanium Level (96%) HBA Controller support via Broadcom® 3616 Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 4x 40mm and 4x 80mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8 + x8 for SAS3

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8 4. Dual 10GBase-T LAN w/ Intel® X540

1. Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2000W Redundant Power Supplies Titanium Level (96%)