Top Loading Storage

1. Single socket FCBGA 1283 supports Intel® Atom® processor C2750 2. System on Chip 3. 12x 3.5" Hot-swap HDD bays 4. Up to 64GB Unbuffered ECC/non-ECC DDR3 1600MHz in 4x DIMM slots 5. 1x PCI-E 2.0 x4 (in x8, LP, HL) 6. Dual GbE LAN ports with SoC 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. I/O ports: IPMI, 2x GbE, VGA 9. 400W High-efficiency redundant short depth Power Supplies

1. Intel® Pentium® processor D1508, Single socket FCBGA 1667; 2-Core, 4 Threads, 25W 2. 12x 3.5" SAS2/SATA3 Hot-swap HDD bays 3. Expansion slot: 1x PCI-E 3.0 x8, M.2 PCIe 3.0 x4, M Key 2242/2280/ 22110, Mini-PCIe w/ mSATA support 4. Up to 128GB ECC RDIMM DDR4 1866MHz or 64GB ECC/non-ECC UDIMM in 4 sockets 5. Dual 10G SFP+ and dual 1GbE LAN 6. 2x USB 3.0 ports (rear), 5x USB 2.0 ports (4 via headers, 1 Type A) 7. 5x 4cm middle fans 8. 400W High-efficiency redundant short depth Power Supplies

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays; 2 rear Hot-swap 2.5" SATA drive bays; optional 6 NVMe bays 6. Broadcom 3008 SAS3 IT mode controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 hot-swap 8cm redundant PWM fans PWM fans 9. 1600W Redundant Power Supplies Platinum Level (94%+) Certified 10. Front 3.5" LCD display

1. Intel® Xeon® processor D-1537, Single socket FCBGA 1667; 8-Core, 16 Threads, 35W 2. 12x 3.5" SAS2/SATA3 Hot-swap HDD bays 3. Expansion slot: 1x PCI-E 3.0 x8, M.2 PCIe 3.0 x4, M Key 2242/2280/ 22110, Mini-PCIe w/ mSATA support

1. Dual Node Twin Architecture, 2x compute Each node controls 45 drives 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card

1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 2. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® Intel® DCPMM 3. 2 PCIe 4.0 x16 (LP) slots, 2 PCIe 4.0 x8 (LP) slots 4. Intel® Ethernet Controller X550 2x 10GbE RJ45 5. Redundant Titanium 1600W Power Supply

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. 60 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%)

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 45x Top-loading hot-swap 3.5" SAS3/SATA3 drive bays, 2x Hot-swap 2.5" SATA drive bays (rear), Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" SATA3/NVMe Gen 4 (rear, optional) Redundant Platinum 1600W Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8