UltraServer

NEBS Level 3 certified for Telecommunication Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 24 DIMMs; up to 2TB 3DS ECC DDR4-2933MHz† RDIMM 2 PCI-E 3.0 x16 (FH, 10.5"L), 1 PCI-E 3.0 x8 (LP), 1 internal PCI-E 3.0 x16 (for SMCI storage controller) Flexible networking options, up to 25GbE via Ultra Riser card 12 Hot-swap 2.5" drive bays (6 NVMe/SATA3 + 6 SATA) 8 Heavy duty fans w/ optimal fan speed control 1600W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP)

1. Dual Socket P (LGA 3647) support (Intel® Xeon® Gold 6254 included) 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, (12x 16GB DDR4-2933MHz included) 3. 2 PCI-E 3.0 x16 slots (FH, 10.5"/10" L), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x8 (internal SAS3 integrated 3108) 4. 4 Gigabit Ethernet ports 5. 8 Hot-swap 2.5" SAS3 drive Bays; 2 Hot-swap NVMe bays 6. 8 heavy duty fans w/ optimal fan speed control 7. 750W Redundant Power Supplies Platinum Level (94%+)

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 7 PCI-E 3.0 x8 slots (5 FH, 10.5" L, 1 LP, 1 Internal LP) 4 Gigabit Ethernet ports 12 Hot-swap 3.5" Drive Bays: 4x heavy duty fans w/ optimal fan speed control 1000W High efficiency (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L), 2 PCI-E 3.0 x8 slots (1 LP, 1 internal LP) 4. 4 10GBase-T Ethernet ports

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L), 2 PCI-E 3.0 x8 slots (1 LP, 1 internal LP) 4. 4 10GBase-T Ethernet ports

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. Up to 7 PCI-E 3.0 x8 slots (up to 5 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 2x 10GBase-T ports 5. 12 Hot-swap 3.5" Drive Bays: Default 4 NVMe ports; 12 SAS3 ports via Expander and AOC: AOC-S3108L-H8iR-16DD, AOC-S3108L-H8iR, AOC-S3008L-L8e, AOC-S3008L-L8i; Optional 2 hot-swap 2.5" rear drive bays for SSDs 6. 4 heavy duty fans w/ optimal fan speed control 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x8 slots (LP) 4. 2x 25G SFP28 Ethernet ports 5. 24 Hot-swap 2.5" drive bays

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP)