4 GPU

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 4 PCI-E 3.0 x16 (FHFL), 1 PCI-E 3.0 x16 (LP) and 1 PCI-E 3.0 x8 (LP) 4. 2 Hot-swap 2.5" NVMe drive bays, 2 Internal 2.5" SATA drive bays 5. Support 1x M.2 2242/2260/2280, Support M.2 SATA and NVMe 6. 2x 10GBase-T LAN ports via Intel X540 7. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control 8. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 6 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x4 (in x8 slot) 4. 8 Hot-swap 3.5" drive bays 5. 2x 10GBase-T LAN ports via Intel X550 6. 1 VGA, 2 COM, 5 USB 3.0 7. 4 Heavy duty fans, 4 exhaust fans, and 2 active heatsink with optimal fan speed control 8. 2200W Redundant Power Supplies Titanium Level (96%) 9. GPU Kit for passive GPU/Coprocessor support (MCP-320-74702-0N-KIT)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 11 PCI-E 3.0 x16 (FH, FL) slots 1 PCI-E 3.0 x8 (FH, FL in x16 slot) 4. Up to 24 Hot-swap 2.5" drive bays; 10x 2.5" drives supported natively, 1 NVMe based M.2 SSD 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 10 PCIe Gen 5.0 X16 LP Slots AIOM / OCP 3.0 Support AIOM/OCP 3.0 Support Flexible networking options 10x 2.5" Hot-swap NVMe/SATA/SAS drive bays 2 M.2 NVMe and SATA for boot drive only

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 4x PCI-E 3.0 x16 slots (4x GPU/ Xeon Phi cards opt.), 2x PCI-E 3.0 x8 (in x16) LP slot

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM 4U system with NVIDIA® HGX™ A100 4-GPU 6 PCI-E Gen 4.0 X16 LP Slots Highest GPU communication using NVIDIA® NVLINK™ Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)