All-Flash NVMe

1. Supports 32 Hot-swap NVMe SSDs 2. Individual HDD power cycling 3. 4 PCI-E x16 IO ports, 2 PCI-E x16 slots 4. IPMI management with dedicated LAN 5. 1000W Redundant Power Supplies Titanium Level (96%)

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (FHHL) slots, 1 PCI-E 3.0 x4 (LP) slot

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L), 4 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. Up to 7 PCI-E 3.0 x8 slots (up to 5 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 2x 10GBase-T ports 5. 12 Hot-swap 3.5" Drive Bays: Default 4 NVMe ports; 12 SAS3 ports via Expander and AOC: AOC-S3108L-H8iR-16DD, AOC-S3108L-H8iR, AOC-S3008L-L8e, AOC-S3008L-L8i; Optional 2 hot-swap 2.5" rear drive bays for SSDs 6. 4 heavy duty fans w/ optimal fan speed control 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot 4. Dual port 10GBase-T (Intel® X540), Intel® XL710 used for dedicated heartbeat between 2 nodes in SBB 5. 20 Hot-swap 2.5" dual port NVMe drive bays 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 high-performance 8cm PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 7 PCI-E 3.0 x8 slots (5 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 2x 10GBase-T ports

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 6 PCI-E 3.0 x8 slots (4 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 4x 10GBase-T ports

Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP. Supports 32 DIMMs with 2DPC, up to 8TB memory capacity with 32 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory Two PCIe 5.0 x16 slots & two PCIe x8 slots and two AIOM connectors (OCP 3.0 SFF compliant) 24x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 2000W Power Supplies