Components

1. Intel® Atom® Processor x7433RE (9W, 4C) 2. DDR5 4800 MHz, SODIMM x 1, Up to16GB, In-Band ECC supported 3. M.2 M-Key 2242/2280, M.2 E-key 2230, M.2 B-key 2240/3052/2280 4. Dual 2.5GbE, M.2 B-key w/ nano SIM & 5G module supported 5. 9-36V wide range power with RVP and TVS

1. Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3/v4, 4th/5th gen. Core i7/i5/i3 processors 2. Intel® C226 Express PCH 3. Up to 32GB DDR3 ECC/non-ECC 1600MHz UDIMM in 4 sockets 4. Dual Gigabit Ethernet LAN ports (1 Intel® i217LM & 1 Intel® i210AT) 5. 8 SATA3 (6Gbps) ports

1U Passive CPU Heatsink with 478pin Socket

Key Features System on Chip Intel® Xeon® Processor D-1732TE, CPU TDP 52W Up to 256GB Registered ECC RDIMM, DDR4-2667MHz, in 4 DIMM slots 1 PCI-E 4.0 x16 or 2 PCI-E 4.0 x8 1 M.2 M-Key 2280 (SATA/PCI-E 3.0 x4) 1 M.2 B-Key 2280/3042/3052 (USB/SATA/PCI-E 3.0 x2) 1 M.2 E-Key 2230 (PCI-E 3.0 x1) 2 PCI-E 3.0 NVMe x4 SlimSAS Internal Port (4 SATA/PCI-E 3.0 x4) Dual 1G RJ45 with Intel® i210-IT Dual 25G SFP28 with Intel SoC SoC controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 12V DC or ATX Power Input

1. 520W High-efficiency Power Supply 2. 4x 3.5" Hot-swap SAS / SATA Drive Bays 3. 1x Slim DVD ROM Drive (Optional) 5. 4x 4cm PWM Fans 6. 1x Full-height, Half-length I/O Expansion Slot

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 8 PCIe 5.0 NVMe x4 Internal Port(s)

Cloud Backup, Data Replication, or High Density Archive Storage Applications 2U Storage JBOD Chassis with capacity 12 x 3.5" hot-swappable HDDs bays Single Expander Backplane Boards support SAS3/2 or SATA3 HDDs with 12Gb/s throughput 4 x Mini-SAS HD ports for Internal / External Cascading Expander Combination for high performance, high availability or high redundancy requirements 1x IPMI port for Remote System Power on/off and system monitoring Support NTP for time synchronization & RTC battery backup 740W (1+1) 95% efficient Platinum level power supplies 3 x 80mm high efficient hot-swappable fans for best system cooling Ideal for Cloud backup, data Replication or High desnsity Archive Storage Applications Qualified SAS HBA / controller: AOC-SAS3-9300-8E - 12Gb/s 2-external ports SAS3 HBA AOC-SAS3-9380-8E - 12Gb/s 2-external ports SAS3 RAID Controller

Intel® Atom® Processor x6211E. Socket FCBGA-1493 supported, CPU TDP supports Up to 6W TDP System on Chip Up to 32GB Unbuffered ECC/non-ECC SO-DIMM, DDR4-3200MHz, in 2 DIMM slots 1 PCI-E 3.0 X2 (in x8 slot) 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042/2280 1 M.2 E-Key PCI-E 3.0 x1/USB 2.0, 2230 1 DP (DisplayPort) port, 1 HDMI port, 1 VGA port, 1 eDP (Embedded DisplayPort) port, Supports 3 independent displays

4-Port SFP28 Connector Low-Profile, Short Length Standard Form Factor PCI-E 4.0 x8 backward compatible to PCI-E 3.0 x8 Intel E810-CAM1 Ethernet Controller Asset Management Feature with thermal sensor Intel Ethernet Flow Director

Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Dual LAN with Intel® Ethernet Controller I210-IT 1 M.2 B-Key 2280, 1 Full size Mini-PCI-E, 1 SATA 3.0 1 HDMI, 1 VGA, 1 48-bit LVDS, Intel® HD Graphic 3 independent displays 2 USB 3.0 ports, 4 USB 2.0 ports, 4 COM ports, 1 SATA 3.0, 8-bit GPIO, SMBus Supports 12V DC power input Wide temperature suppot from -30°C to 75°C

90° Rotatable HDD Cage Whisper-Quiet (

1. Form Factor: OCP 3.0 / AIOM 2. NIC: 2x 10GbE RJ45 Intel® X710-AT2 3. BUS: PCIe 3.0 x4