Components

1. Intel® Celeron™ J1900 (10W, 4C) 2. Intel® Silvermont microarchitecture 22nm System-on-Chip 3. Up to 8GB 1333MHz DDR3L Non-ECC SO-DIMM in 2 socket 4. 1x PCI-E x2, 1x Mini-PCIe slot and 1x mSATA slot, 2x SATA 2.0, 4x SATA 3.0 (RAID 0, 1, 10)

1. Form Factor: OCP 3.0 / AIOM 2. NIC: 2x 10GbE RJ45 Intel® X710-AT2 3. BUS: PCIe 3.0 x4

1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s 2. Intel® C621 3. Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots 4. 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 5. 1 VGA port 6. Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10 7. Dual LAN with GbE from C621

1. Extreme High Density and High Capacity Storage Chassis support 60 x 3.5" Top Loading SAS/SATA 12Gb/s Hot Swapping HDD/SSD Bays 2. Tool-less HDD tray with HDD LED indicator 3. Dual Expander Backplane Boards support SAS3/2 HDDs with 12Gb/s throughput 4. 8 x Mini-SAS HD ports for Internal / External Cascading Expander Combination for high performance, high availability or high redundancy requirements 4. 1x IPMI port for Remote System Power on/off and system monitoring 5. Support NTP for time synchronization & RTC battery backup 6. 1600W (1+1) Redundant High-efficiency Platinum Level Power Supplies 7. Optimized cooling w/ 5x 80x38mm rear hot-swap fans 8. Support front LCD panel for system status & error info (Option) 9. Ideal for Cloud backup, data Replication or High density Archive Storage Applications

[NR]2x SATA M.2 RAID Carrier, Standard LP,RoHS

Size: 80 mm Speed: 10 500 RPM Acoustic noise level: 60 dBA Maximum airflow low rate: 100,6 RPM Connector: 4 pin

Supermicro Internal Reverse Breakout Crossover MiniSAS to 4 SATA 70/70/70/70cm Cable

1. Intel® 4th Generation Core™ i3 series, Intel® 4th Generation Core™ i5 series, Intel® 4th Generation Core™ i7 series. 2. Socket LGA 1150 supported 3. CPU TDP support Up to 150W TDP 4. Intel® Z97 5. Up to 32GB Unbuffered non-ECC UDIMM, DDR3-3300MHz (OC), in 4 DIMM slots

2U chassis support for SMC Proprietary WIO motherboards max. motherboard size - 12" x 13", 13" x 13.68". S upport up to 12"x13" MB with rear 2.5" HDD option installed 24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay

LP Prop. Passive HS w/Mid Air CH, B12 14 Blade Super Servers

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs (Board revision 2.x required) Expansion slots:  3 PCI-E 3.0 x16  3 PCI-E 3.0 x8  M.2 Interface: 1 PCI-E 3.0 x4  M.2 Form Factor: 2280, 22110  M.2 Key: M-key 8 SATA 3.0 + Broadcom 3008 for 8 SAS3 ports + 2 NVMe, 1 M.2