Storage Solutions

1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors 2. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots 3. 2x 10 GbE onboard via Broadcom BCM57416

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

Up to 4TB ECC DDR4-3200: LRDIMM/RDIMM 2x 25G SFP+ Ports Onboard 12x 3.5" hot-swap SAS/SATA, 4x hot-swap EDSFF Short Bays, 2x 2.5" 7mm NVMe/Hot-Swap SATA drive bays Front LED Indicator for each drive Host Bus Adapter via Broadcom® 3224 PCI-E 4.0 x16 AIOM Support + 3 PCI-E 4.0 LP Slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card

Single AMD EPYC™ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 16 DIMMs; Up to 4TB 3DS ECC Registered DDR4-3200MHz RDIMM/LRDIMM 2 PCI-E 4.0 x16 (FHHL) Slots, 1 PCI-E 4.0 x16 (LP) Slot 2x 10GBase-T LAN Ports via Broadcom BCM57416 Controller 12x 3.5" SAS3/SATA3 Hot-Swap Drive Bays, 4x 2.5" 7mm U.2 NVMe Hot-Swap Drive Bays 800W Redundant Power Supplies Platinum Level High-efficiency (Full redundancy based on configuration and application load.) RAID support via Broadcom® 3916

1. Dual Node Twin Architecture, 2x compute Each node controls 30 drives 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 3 PCI-E 3.0 x8 (1 FHHL, 2 LPHL) expansion slots per controller; up to 3 add-on cards 4. Dual 10GBase-T LAN w/ Intel® X540; 100Mb private Ethernet between controller nodes 5. 16x 3.5" Hot-swap SAS3/SATA3 drive bays with SES2 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 12x 4cm PWM cooling fans 9. 1200W Redundant Power Supplies Titanium Level (96%)