SuperWorkstations

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

X10 4U72 Ceph data node w/360TB volume and SSD.

Fanless DIN Rail Mounted System Fanless Embedded chassis with 4.96" (126mm) depth Intel® Atom® x7433RE up to 9W TDP 1 DIMM supporting up to 16 GB of Non-ECC DDR5 SO-DIMM with speeds up to 4800 MT/s 2 RJ45 2.5GbE

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8 (slot 1 & 2 occupied by controller and JBOD expansion port) 4. Dual 10GBase-T LAN w/ Intel® X540 5. 36x 3.5" Hot-swap drive bays (24 front + 12 rear): 32x 3.5" Hot-swap SAS3/SATA3 drive bays and 4x NVMe hybrid drive bays (SAS3/SATA3/NVMe*); 2x 2.5" optional Hot-swap SATA drive bays (rear); 4x 2.5" internal fixed drive bays 6. SAS3 via Broadcom 3008 controller; IT mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7x 80mm middle cooling fans 9. 1280W Redundant Power Supplies Platinum Level (94%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (for SIOM ) 4. 2 Fixed 3.5" SATA3 drive bays M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 5. Dual GbE ports via SIOM Network card, 1 dedicated IPMI LAN port (front) 6. 1 VGA, 2 USB 3.0 ports (front) 7. 8x 8cm 13.5k RPM rear fans per enclosure 8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

Supports both Intel® Xeon® W-1200 Series and 10th Generation Intel® Core™ Processors 2 PCI-E 3.0 x16 slots (16/NA or 8/8) M.2 Interface: 2 PCI-E 3.0 x4 Dual LAN ports, GbE and 2.5GbE 12cm PWM quiet exhaust fan and optional 12cm front intake fan 668W 80PLUS Platinum Power Supply