SuperWorkstations

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, CPU TDP support Up to 260W 2. Intel® C612 chipset 3. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots 4. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 5. 6x 3.5" and 4x 2.5" tool-less drive bays, 2x 5.25" peripheral bays

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8 slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

Single Socket AM5 (LGA-1718) AMD Ryzen™ 7 8700G, 8 cores/16 threads, 4.2/5.1GHz Turbo 65W Ryzen AI at 16 TOPS Processor AMD Radeon 780M, 12 core, 2900 MHz 32GB DDR5 4800 Non-ECC UDIMM (Max 4 DIMM up to 192GB) 1 RJ45 1GbE + 2 RJ45 1GbE

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 GbE LAN ports via Intel i210 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5" SATA drive bays; optional 2 SATA or NVMe 6. Broadcom 3108 SAS3, HW RAID (AOC-S3108L-H8IR-P ) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 Hot-swap 8cm redundant PWM fans 9. 1600W Redundant Power Supplies Platinum Level

1. Single socket R4 supports Intel® Core™ i9/i7/i5 X-Series, and Intel® Core™ i9 Extreme X-Series Processors 2. Intel® X299 chipset 3. Up to 128GB Non-ECC UDIMM, DDR4-2666MHz, in 8 DIMM slots 4. 4 PCI-E 3.0 x16; 1 PCI-E 3.0 x4, 2 M.2 M key with Intel® Optane™ support

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3, E5-1600 v4†/ v3, 4th gen. Core i7 2. Intel® C612 chipset 3. Up to 512GB ECC DDR4 2400†MHz LRDIMM or 128GB ECC/non-ECC UDIMM (available with Core i7 only); 8x DIMM slots 4. 4x PCI-E 3.0 x16 slots (runs at 16/16/NA/8 or 16/8/8/8), 2x PCI-E 2.0 x1 (in x4) slots 5. I/O Ports: 2 GbE, ALC 1150 HD Audio, 6 USB 3.0 + 2 USB 3.0 (front), 1 COM, 1 TPM, 1 PS/2 Keyboard/Mouse port 6. 4x 3.5" internal drive bays 7. 900W Multi-Output Power Supply