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1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card

Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processor. Up to 300W TDP. 16 ECC DDR5-5600: LRDIMM/RDIMM Two Dedicated PCIe 5.0 x16 AIOM slots (OCP 3.0 SFF compliant) Up to 6x PCIe 5.0 Slots (Slot #2 populated by 3908 controller by default) Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 60x 3.5" Hot-swap SAS3/SATA3 drive bays; 2x 2.5" rear Hot-swap SATA drive bays; optional 6 NVMe bays 6. Broadcom 3108 SAS3 HW RAID controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5x 8cm hot-swap redundant PWM fans PWM fans 9. 2000W Redundant Power Supplies Titanium Level (96%) Certified 10. Front 3.5" LCD display

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8 + x8 for SAS3

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8 4. Dual 10GBase-T LAN w/ Intel® X540

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 2.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 8x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 45x Top-loading hot-swap 3.5" SAS3/SATA3 drive bays, 2x Hot-swap 2.5" SATA drive bays (rear), Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" SATA3/NVMe Gen 4 (rear, optional) Redundant Platinum 1600W Power Supply