Workstations

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core™ i7/i5/i3 series 2. Intel® Z270 Express Chipset 3. Up to 64GB Non-ECC UDIMM, DDR4-3733MHz (OC), in 4 DIMM slots 4. 4 PCI-E 3.0 x16 (run at 16/NA/16/NA, 8/8/8/8, Auto Switch), 1 PCI-E 3.0 x4 5. 2 PCIe 3.0 x4 M.2 (support 22110) 1 compatible w/ SATA; RAID 0, 1 support 6. 2 PCIe 3.0 x4 U.2 (1 share with M.2); RAID 0, 1 support 7. USB 3.1/3.0/2.0, 2 GbE LAN ports (1 via Intel i210-AT, 1 via Intel i219V) 8. Removable 3.5" and 2.5" HDD/SSD cages with tool-less trays for up to 10 drives; 2x 5.25" Peripheral Drive Bays 9. 1 DP (Display Port), 1 HDMI 10. HD Audio 7.1 channel connector by Realtek ALC1150, support SPDIF-Out 11. 750W Multi-output ATX Power Supply with modular cable; 80Plus Gold

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Quad socket R1 (LGA 2011) supports Intel® Xeon® processor E7-8800 v4/v3, E7-4800 v4/v3 family (up to 24-Core) 2. Up to 2TB DDR3 (64GB LRDIMM), up to 1600MHz; 32x DIMM slots 3. 2x PCI-E 3.0 x16 FH slot; 2x PCI-E 3.0 x8 FH slot 4. Intel® X540 Dual port 10GBase-T 5. I/O ports: 2x 10GBase-T, 1x Dedicated LAN for IPMI Remote Management, 1x VGA, 1x COM port, 3x USB 2.0 6. 5x 3.5" Hot-swap SAS2 Drive Bays; SAS2 via onboard Broadcom 3008 7. 3x 9cm + 3x 8cm Heavy Duty fans with speed control 8. 1400W Redundant Digital PS Platinum Level (95%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Single socket H2 (LGA 1155) supports Intel® Xeon® E3-1200 & v2 series, 2nd Gen Core i3 processors* 2. Up to 32GB DDR3 ECC 1333MHz / 1600MHz* UDIMMs in 4 sockets 3. 1 PCI-E 3.0* x16, 2 PCI-E 2.0 x4 in x8, and 3 PCI 32-bit Expansion Slots 4. Intel® 82574L, 2x GbE LAN ports 5. Front I/O: 2x USB 2.0 ports 6. 4x 3.5" internal SATA HDDs and opt. 4x 2.5" HDD cage, 90° rotatable 7. 500W High-efficiency Power Supply

1. Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3, 4th gen. Core i7/i5/i3, Pentium, Celeron processors 2. 4x 3.5" Hot-swap drive bays, 2x 2.5" fixed drive bays 3. 1x PCI-E 3.0 x16 slot, 1x Mini-PCIe with mSATA support

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, CPU TDP support Up to 260W 2. Intel® C612 chipset 3. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots 4. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 5. 6x 3.5" and 4x 2.5" tool-less drive bays, 2x 5.25" peripheral bays 6. Dual GbE LAN port via Intel® i350 7. Dual cooling zones, 6 fans total 1x 12cm rear exhaust fan 8. 750W Multi-output Power Supply

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified