Workstations

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 64GB ECC UDIMM, up to DDR4-2666MHz; 2 DIMM slots 4. 1 PCI-E 3.0 x16 slot (for LP AOC)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM slots 3. Expansion slots: 3 (x16) PCI-E 3.0, 2 (x8) PCI-E 3.0 & 1 (x4) PCI-E 3.0 4. Intel® i350 Dual port Gigabit Ethernet 5. 2x SATA3 and 8x SATA2 ports 6. 4x 3.5" SATA HDD bays, 90° rotating hard drive cage, 4x 2.5" internal HDD/SSD bays (opt.) 7. 900W High Efficiency Power Supply Gold Level Certified

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

X10 4U72 Ceph data node w/432TB volume . No SSD.

1. Intel® Xeon® processor D-1541, Single socket FCBGA 1667; 8-Core, 45W 2. 4x 3.5" Hot-swap drive bays; 2x 2.5" fixed drive bays 3. 1x PCI-E 3.0 x16 (LP), 1x M.2 PCI-E 3.0 x4, M Key 2242/2280 4. Up to 128GB ECC RDIMM DDR4 2400MHz or 64GB ECC/non-ECC UDIMM in 4 sockets

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3, E5-1600 v4†/ v3, 4th gen. Core i7 2. Intel® C612 chipset 3. Up to 512GB ECC DDR4 2400†MHz LRDIMM or 128GB ECC/non-ECC UDIMM (available with Core i7 only); 8x DIMM slots 4. 4x PCI-E 3.0 x16 slots (runs at 16/16/NA/8 or 16/8/8/8), 2x PCI-E 2.0 x1 (in x4) slots 5. I/O Ports: 2 GbE, ALC 1150 HD Audio, 6 USB 3.0 + 2 USB 3.0 (front), 1 COM, 1 TPM, 1 PS/2 Keyboard/Mouse port 6. 4x 3.5" internal drive bays 7. 900W Multi-Output Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray) 4. Support 8 Tesla V100 with 300GB/s NVLINK 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2 NVMe based M.2 SSD 7. 8x 92mm cooling fans 8. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)