Workstations

The HPE ProLiant ML110 Gen10 is the ideal first server for growing businesses. CPU: Intel® Xeon-S 4210R 10-Core (2.4GHz, 13.75MB L3 Cache). Memory: 16GB (1 x 16GB) Single Rank x4 DDR4-2933 Registered (RDIMM), 6 memory slots in total. Network Controller: integrated 1Gb 2-port 332i Adapter

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM slots 3. Expansion slots: 3 (x16) PCI-E 3.0, 2 (x8) PCI-E 3.0 & 1 (x4) PCI-E 3.0 4. Intel® i350 Dual port Gigabit Ethernet 5. 2x SATA3 and 8x SATA2 ports 6. 4x 3.5" SATA HDD bays, 90° rotating hard drive cage, 4x 2.5" internal HDD/SSD bays (opt.) 7. 900W High Efficiency Power Supply Gold Level Certified

1. Quad socket R1 (LGA 2011) supports Intel® Xeon® processor E7-8800 v4/v3, E7-4800 v4/v3 family (up to 24-Core) 2. Up to 2TB DDR3 (64GB LRDIMM), up to 1600MHz; 32x DIMM slots 3. 2x PCI-E 3.0 x16 FH slot; 2x PCI-E 3.0 x8 FH slot 4. Intel® i350 Dual port GbE LAN 5. I/O ports: 2x GbE LAN, 1x Dedicated LAN for IPMI Remote Management, 1x VGA, 1x COM port, 3x USB 2.0 6. 5x 3.5" Hot-swap SATA Drive Bays 7. 3x 9cm + 3x 8cm Heavy Duty fans with speed control 8. 1400W Redundant Digital PS Platinum Level (95%)

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1.5TB ECC DDR3, up to 1866MHz; 24x DIMM slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8 (slot 1 & 2 occupied by controller and JBOD expansion port) 4. Dual 10GBase-T LAN w/ Intel® X540 5. 36x 3.5" Hot-swap drive bays (24 front + 12 rear): 32x 3.5" Hot-swap SAS3/SATA3 drive bays and 4x NVMe hybrid drive bays (SAS3/SATA3/NVMe*); 2x 2.5" optional Hot-swap SATA drive bays (rear); 4x 2.5" internal fixed drive bays 6. SAS3 via Broadcom 3008 controller; IT mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7x 80mm middle cooling fans 9. 1280W Redundant Power Supplies Platinum Level (94%)

1. Single socket H3 (LGA 1150) supports Intel® 4th gen. Core i7/i5/i3 processors 2. Intel® Z87 Chipset 3. Up to 32GB DDR3 non-ECC 1600MHz UDIMM in 4 sockets; Overclocking* support up to 3000MHz

1. Quad socket R1 (LGA 2011) supports Intel® Xeon® processor E7-8800 v4/v3, E7-4800 v4/v3 family (up to 24-Core) 2. Up to 2TB DDR3 (64GB LRDIMM), up to 1600MHz; 32x DIMM slots 3. 2x PCI-E 3.0 x16 FH slot; 2x PCI-E 3.0 x8 FH slot 4. Intel® X540 Dual port 10GBase-T 5. I/O ports: 2x 10GBase-T, 1x Dedicated LAN for IPMI Remote Management, 1x VGA, 1x COM port, 3x USB 2.0 6. 5x 3.5" Hot-swap SAS2 Drive Bays; SAS2 via onboard Broadcom 3008 7. 3x 9cm + 3x 8cm Heavy Duty fans with speed control 8. 1400W Redundant Digital PS Platinum Level (95%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

10th Gen Intel® Core™ and Intel® Xeon® W-1200 processors, Full-height graphics cards, Up to NVIDIA® Quadro® P2200, Ideal for3D CAD, design, visualization and multimedia applications, Extremely quiet workstation

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

Single Socket AM5 (LGA-1718) AMD Ryzen 7 8700G, 8 cores/16 threads, 4.2/5.1GHz Turbo 65W Ryzen AI at 16 TOPS Overall AI Inference Performance at 39 TOPS (CPU+GPU+NPU) AMD Radeon 780M, 12 core, 2900 MHz Nvidia RTX 4070, 12GB GDDR6X, 2.48GHz Boost, 5888 CUDA, 466 TOPS 32GB DDR5 4800 Non-ECC UDIMM (Max 4 DIMM up to 192GB) 1 RJ45 1GbE + 2 RJ45 1GbE 2 PCIe 5.0 x16 (1 used by Nvidia RTX 4070) 1 PCIe 4.0 x4