Workstations

Intel® Xeon® W processors, Up to NVIDIA RTX™ A6000 or AMD Radeon™ Pro WX 3200, Ideal for high-end CAD, M&E, rendering and simulation applications, Supports NVIDIA® NVLink™ technology

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

12th Gen Intel® Core™ (up to i9), Professional graphics cards support, Up to 128 GB DDR5 4.400 MHz memory, Ideal for AEC, BIM, M&E, Product Design and Manufacturing workflows

The HPE ProLiant ML30 Gen10 server is a powerful yet affordable tower server designed for small offices, remote and branch offices to run on-premise and Hybrid Cloud solutions, delivering enterprise-class performance, security, reliability, and expandability at a lower cost. Just a small change can give you an extra edge. Hewlett Packard Enterprise builds security right into the server with HPE iLO silicon root of trust, making the HPE ProLiant ML30 Gen10 server one of the world's most secure industry-standard servers. Redundant power supply option and up to 4 LFF or 8 SFF hot-plug HDDs provide availability and flexibility. The enhanced expansion capability allows you to upgrade with serial attached SCSI (SAS) controllers, networking cards, or graphics cards as your business grows. You will be surprised at how much benefit you can get with HPE ProLiant ML30 Gen10 server.

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

CPU: Intel Xeon Silver 4215 (2.5GHz) RAM: 16GB - DDR4 SDRAM ECC 2933MHz Power suply: 800 W 80PLUS: Platinum

12th Gen Intel® Core™ (up to i9), Professional graphics cards support, Up to 128 GB DDR5 4.400 MHz memory, Ideal for AEC, BIM, M&E, Product Design and Manufacturing workflows

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 11 PCI-E 3.0 x16 (FH, FL) slots 1 PCI-E 3.0 x8 (FH, FL in x16 slot) 4. Up to 24 Hot-swap 2.5" drive bays; 10x 2.5" drives supported natively, 1 NVMe based M.2 SSD 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

12th Gen Intel® Core™ (up to i9), Professional graphics cards support, Up to 128 GB DDR5 4.400 MHz memory, Ideal for AEC, BIM, M&E, Product Design and Manufacturing workflows

Intel® Core™ i7 / i7 Extreme Edition, and Intel® Xeon® 5600/5500/3600/3500 series (QPI up to 6.4 GT/s) Up to 24GB DDR3 1600/1333/1066/800 ECC / non-ECC Un-Buffered DIMM 2 (x16) PCI-Express 2.0, 1 (x4) PCI-Express (using x8 slot), 1x 32-bit PCI Slots Intel® Dual 82574L Gigabit Ethernet Controller Supports nVidia® SLI™ and ATI® CrossfireX ™ Technology 8x 3.5" Hot-swap SATA Drive Bays 865W Low-Noise High Efficiency Cooling-Redundant Power Supply Tower or Rackmount PWM Fan Speed Control

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots